Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available.
Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCb warpage, the effects of improper curing and potential methods for correcting these situations. Finally, advances in superhydrophobic materials will be addressed to demonstrate the direction the industry is taking with respect to this topic.
Webinar by DfR Solutions, presented by Greg Caswell. Thursday the 16th of Febryary, 11.00 AM EST or 2:00 PM EST.
