At this edition of E-16 Odense we host 6 free technical seminars at Tuesday and Wednesday in the conference rooms of Odense Congress Center, room nr 7. See beneath an overview of the scheduled seminars. And of course, the presenters will be available for all your questions.
Tuesday 6th of September:
‘Physics of Failure Prediction for Electronic Components and Systems’ by Dr Craig Hillman, DfR Solutions.
Abstract: There is an increasing interest in Physics of Failure (PoF) within the electronic community, especially from system integrators who are increasingly concerned about the time and resources required to perform accelerated life testing and disruptions that occur due to unexpected failures failures.
Time: 11.00 – 12.30 hr
‘Electronics Cooling, Solutions for Thermal Analysis & Fluid Flow Simulation’ by Michael Kasperski, Mentor Graphics
Abstract: The management of the heat dissipated in electronics has long been recognized as a major challenge. The challenge is to prevent overheating, and failure, of critical components via appropriate cooling strategies.
Time: 12.30 – 14.00 hr
‘BOM Management, Product – date or “stucture and order” by Chuck McGinly, Omnnify Software
Abstract: To have the possibility of securing that the management of data around a product is quick, secure and standardized lowers the time required to design a correct product. Lower thee risk of using obsolete or out-of date data and all other day to day challenges that you will face.
Time: 14.00 – 15.30 hr
Wednesday 7th of September:
‘PADS’ by Steve Gascoigne, Mentor Graphics
Abstract: Today’s design engineers face challenges designing today’s electronic products. The PADS Product Creation platform is uniquely positioned to help engineers overcome these challenges by making simulation and analysis technology accessible to the mainstream, through both pricing and integration with the PADS flow.
Time: 11.00 – 12.30 hr
‘Electronics Cooling, Solutions for Thermal Analysis & Fluid Flow Simulation’ by Michael Kasperski, Mentor Graphics
Abstract: The management of the heat dissipated in electronics has long been recognized as a major challenge. The challenge is to prevent overheating, and failure, of critical components via appropriate cooling strategies.
Time: 12.30 – 14.00 hr
‘PADS’ by Lennart Edenfjord, InnoFour
Abstract: Today’s design engineers face challenges designing today’s electronic products. The PADS Product Creation platform is uniquely positioned to help engineers overcome these challenges by making simulation and analysis technology accessible to the mainstream, through both pricing and integration with the PADS flow.
Time 14.00 – 15.30 hr
