Enhance electronics reliability with a streamlined simulation and test approach

Increasing semiconductor content is an emerging trend across consumer electronics, automotive and aerospace industries. The latest packaging technologies integrate increasingly high computing power in a single package, creating thermal and mechanical design challenges at both the package and PCB board levels.

Power conversion components, such as electric traction applications, are changing too. They switch increasing amounts of power while maintaining the same package footprints. Thermal, shock and vibration-related reliability of the PCB or the component is concerning.

This on demand webinar demonstrates how to import ECAD data into the mechanical environment and use simulation tools to support thermal, structural, and modal analysis of the board or subsystem. Watch a test-based approach that can calibrate the thermal model of selected high-power components while also estimating the power cycling lifetime.