New COM Express® Modules Based on 6th Generation Intel® Core™ and latest Intel® Xeon® Processors

New modules follow the form, fit, function design methodology for increased scalability and flexibility for current and future upgrades.

Data Respons partner, ADLINK, announced new COM Express® computer-on-modules (COMs) based on the 6th generation Intel® Core™ i7/i5/i3 processors and latest Xeon® processors. These new modules follow the form, fit, function design principal for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.

ADLINK’s COM Express computer-on-module (COM) offerings include the cExpress-SL and Express-SL in PICMG COM.0 Type 6 Compact and Basic Size form factors, respectively. Both Basic and Compact size modules are available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. In addition, the Express-SL COM Express Basic Size module features the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset and supports ECC memory.

In both models, DDR4 memory is supported up to a total of 32GB at 1867/2133MHz, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. The new COMs can support up to 32 GB DRAM in two sockets, removing the 16GB limitation DDR3 posed. In addition, the boards benefit of the enhanced security capabilities of the chipset, including new AES instructions, faster encryption, as well as the Intel® Software Guard Extension and Memory Protection.

These new COMs support three independent UHD/4K displays and hardware codec H.265/HVEC with Intel® Gen9 graphics, making them well-suited for image-intensive applications in automation, medical, and infotainment. Models with an extended operating temperature range of -40°C to +85°C are also available for transportation and defense applications.

ADLINK’s latest 6th gen Intel® Core™ processer-based COMs also provide flexible system integration with configurable TDP (cTDP), which allows developers to modify processor behavior to the extent that power consumption and TDP (thermal design power) can be configured; the CPU power consumption can be as low as 7.5W, allowing for even higher CPU performance when constrained in power usage (running on batteries) or heat dissipation (thermal conditions). The rich I/O includes up to three DDI channels, one LVDS (or four lanes eDP), eight high-speed PCIe Gen3, four SATA 6 Gb/s, GbE, four USB 3.0 and four USB 2.0.

See related products on Data Respons products homepage http://www.datarespons.com/products or contact us for further information:

T: +45 8832 7500
M: sales@datarespons.dk