For years, engineers have relied on manual methods to tackle thermal challenges in PCB design. Strategies such as using rules of thumb or excessive cooling were common ways to stay on the safe side. However, while these approaches offered basic control, they often failed to meet the needs of today’s complex and fast-evolving boards. For example, spacing components far apart or applying simple pyramid models to estimate thermal thresholds might seem effective but can leave critical issues unnoticed.
Now, the landscape of PCB design is changing rapidly. Increased power requirements, denser layouts, and higher performance expectations have become standard. As a result, traditional thermal management methods are struggling to keep up. For instance, placing components farther apart to manage heat might reduce thermal risks but often leads to slower communication between essential parts, creating additional challenges.
So, how can engineers address these issues more effectively? Download our white paper to explore innovative solutions and learn how to stay ahead in thermal design.
