Explore how CAD geometry can seamlessly integrate into thermal analysis environments for electronics cooling simulation. This image highlights the use of an MCAD bridge, which supports thermal engineers with Parasolid-based geometry, as well as NX and Solid Edge imports. This enables efficient CAD geometry simplification and preparation for CFD, making system-level simulation tasks easier.
By combining advanced functionality with the ability to handle complex EDA data and component modeling, you can achieve accurate and efficient PCB thermal simulations. Simplify your workflow and get precise results with this integrated approach.