This release delivers electronics applications enhancements for PCB thermal analysis workflows. For example, in the area of processing imported EDA data and component placement, there are new ways to add libraries and quicker methods to swap thermal models of components within the EDA Bridge utility.
Users are also able to more easily create of 2-resistor and LED component thermal models directly in the interface. Learn more about improved handling of missing material for thin gaps in complex CAD assemblies and read on below to discover many other topics such as examples for simulation automation, new plots and goals location functionality, and even batch simulation processing capabilities.
Users can download all variants on SupportCenter
