The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant advantages here. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its internationally proven CoM portfolio with a complete solution for contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate monoblock inlay (Inlam).
This information is available online at
http://www.infineon.com/cms/en/about-infineon/press/market-news/2017/INFCCS201711-011.html
